Redesign of single modules for phase control with baseplate width 70 mm completed

Overall connection dimensions of the new type of modules are set to the world standards which ensure easier mounting of the modules into applications. As a result of structure optimization of semiconductor element it made possible to increase average current of device by 4-5% comparing to the previous version of the modules saving all other characteristics. Mainly it’s connected with increase of semiconductor element diameter from 56 mm up to 60 mm, which allowed lowering static losses and improving thermal characteristics of the modules.

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