POWER SEMICONDUCTOR DEVICES IN MODULE HOUSING
POWER SEMICONDUCTOR DEVICES IN MODULE HOUSING.
Characteristics of the design and the usage of the devices.
Today the Joint Stock Company Proton-Electrotex is widely presented both on the internal and
on the world markets. The company produces a wide range of bipolar power semiconductor
devices in hockey pack, module and stud types of housings. The bipolar power semiconductor
devices in module type of housing will be discussed in the article.
The main advantages of module type of housing are:
1. Base plate through which heat is transferred to the heat sink is isolated from the conductive
parts ( thanks to it several modules can be mounted with the group heat sink without
additional isolation.)
2. The Simplicity of mounting
3. The assembly of the devices in hockey pack with heat sink is more expensive than the
modular assembly. For example three-phase rectifier. Six devices in hockey pack with heat
sink or three modules which are mounted with the same heat sink are necessary for the
performance of the three-phase rectifier. As for the price the modular assembly will be
cheaper. More than that overall dimensions of the modules are less than the overall
dimensions of the devices in hockey pack with heat sink.
The range of produced power semiconductor devices in module type of housing:
1. Module F, double module with base plate 34 mm, with average current 115-245 A, with
blocking voltage 1000-3600 V.
2. Module C, double module with base plate 53 mm, with average current 200-320 A, with
blocking voltage 1000-3400 V.
3. Module A2, double module with base plate 60 mm, with average current 260-660 A, with
blocking voltage 1000-4400 V.
4. Module D, double module with base plate 77 mm, with average current 400-1250 A, with
blocking voltage 100-4400 V.
5. Module E, double module with base plate 70 mm, with average current 500-1250 A, with
blocking voltage 100-3600 V.
The following schemes of connecting of two devices used in production of the modules:
1. two semiconductors are turned on in series with the common terminal.
2. two semiconductors with the common cathode.
3. two semiconductors with the common anode.
The power semiconductor devices in module type of housing which are produced by the
Company Proton-Elecrtotex have pressure contact. In comparison with the solder type of
construction the pressure contact allows to increase thermo cycle life.
The main elements of modules:
- metal base plate. The material is copper through which heat is transferred to the heat sink
- nitride aluminum ceramic disk which is heat conductive electrical isolator between current
conductive parts and base plate
- semiconductor elements
- copper bus bar which connects the semiconductor element
- steal spring.
